Product Description
- Smart Soldering
- Optimized Module Size
- Smart Module Packaging and Logistics
- Optimized Electrical Parameters
- Gallium-doped Technology
- Bifacial Energy Yield
Uniform smart soldering increases the power and efficiency of the module, and improves the power load capacity. Large-format modules with M10 wafer size use dual-glass and frame packaging to ensure module strength. Smart module packaging solutions are used to achieve high reliability, low-cost transportation and logistics. The working current is about 13A, which is perfectly adapted to mainstream string inverters. Gallium-doped technology overcomes LID degradation and guarantees the long-term power generation of the module. Additional power generation from the backside of bifacial modules increases the overall energy yield, which has been verified by customers and third-party testing organizations.
Mechanical Parameters
| Layout | 144 (6X24) |
| Junction box | Split junction box, IP68, 3 diodes |
| Weight | 32.6kg |
| Size | 2278×1134×35mm |
| Packaging | 31 pcs./pallet 155 pcs./20GP 620 pcs./40GP |
Electrical Performance Parameters (STC Test)
| Maximum power (Pmax/W) | 545-555 |
| Open-circuit voltage (Voc/V) | 49.65-49.95 |
| Short circuit current (Isc/A) | 13.92-14.05 |
| Peak power voltage (Vmp/V) | 41.80-42.10 |
| Peak power current (Imp/A) | 13.04-13.19 |
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